ANALYTICAL AND NUMERICAL ANALYSIS OF THERMOSYPHON

The book Analytical and Numerical Analysis of Thermosyphon explores the thermal performance of thermosyphon heat exchangers using computational fluid dynamics (CFD) simulations in ANSYS Fluent. It provides an in-depth study of heat pipes, their principles, types, and industrial applications, with a focus on evaporation and condensation processes. The research investigates the impact of different fill ratios (30%, 50%, and 70%) of water as the working fluid on heat transfer efficiency. Using the Volume of Fluid (VOF) method, the CFD model visualizes phase transitions and heat flow, revealing that a 50% fill ratio offers optimal performance, balancing evaporation and condensation while avoiding dry-out or flooding issues. The findings emphasize the effectiveness of CFD in accurately predicting thermosyphon behavior, reducing the need for experimental testing, and contributing to the optimization of heat pipe designs for applications such as electronics cooling, HVAC systems, and industrial heat recovery.