Electrical Simulation in the GaN Light-Emitting Diode Dies

Electrical Simulation in the GaN Light-Emitting Diode Dies

Current Spreading Analysis in the Active Layer of LEDs Dies

LAP Lambert Academic Publishing ( 2010-05-17 )

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When the chip size of light emitting diodes (LEDs) and the input power become larger, current spreading in the active layer will obviously affect the optical, electrical, and thermal packaging performances of the LED chip. To further understand the current spreading behavior in the active layer, a three-dimensional numerical simulation is developed to analyze the electrical characteristic and current distribution of a GaN LEDs device. The results and trends found could serve as useful references for researchers focusing on the design of an LED chip.

Book Details:

ISBN-13:

978-3-8383-0584-4

ISBN-10:

3838305841

EAN:

9783838305844

Book language:

English

By (author) :

Gwo-Jiun Sheu
Farn-Shiun Hwu
Jyh-Chen Chen

Number of pages:

92

Published on:

2010-05-17

Category:

Heating,- energy- and power station technology